Explore our end-to-end manufacturing capabilities. From high-speed SMT placement lines to precision custom PCB assemblies and full OEM box-build integrations.
Integrated production setups configured for fine-pitch electronics, advanced PCB assemblies, and clean-room standard testing.
High-accuracy placement of 01005 passives, QFN, micro-BGAs, and LED chips supported by multi-zone nitrogen reflow and dual-lane automated lines.
Learn MorePrecision fabrication of active display boards ranging from ultra-fine P0.9 to rugged outdoor P4.81, calibrated for optimal chromatic uniformity.
Learn MoreHigh-density multi-layer printed circuit boards built with strict impedance controls, ensuring optimal heat dissipation and long-term reliability.
Learn MoreAutomated 3D solder paste profiling and inline post-reflow optical inspection for real-time defect isolation and high first-pass yield.
Learn MoreComplete electromechanical assembly including power supply cabling, receiving card integration, thermal sinks, and structural finalization.
Learn MoreHigh-temperature chamber testing, alternating luminescence burn-in, and vibration stress verification to prevent on-site early mortality.
Learn MoreOur automated SMT lines provide fast throughput and placement accuracy down to ±15 microns. Designed to service dense, complex double-sided active electronics with clean nitrogen atmosphere reflow.
We manufacture active LED display modules configured for broadcast studios, command centers, and digital-out-of-home screens. Optical spectrometers guarantee identical binning, color temperature, and brightness match across every module.
State-of-the-art multi-layer PCB assembly ensures flawless signal integrity and robust thermal management. We integrate automated resin encapsulation and conformal coating for extreme environment protection.
A transparent, gate-controlled workflow from Bill of Materials (BOM) review to mass deployment.
Engineers review gerber files, component footprints, and optimize designs for manufacturability.
Initial batch testing to validate reflow thermal curves, optical calibration, and PCB integration.
High-speed volume production under automated optical inspection and automated stencil wash cycles.
Zero-defect aging, final optical color binning, and vibration-proof export packaging.
Our inspection apparatus includes 3D Solder Paste Inspection (SPI), high-resolution in-line AOI, X-ray inspection for BGA voids, and environmental humidity-temperature stress cycling. Zero defects are allowed past testing gates.
Send us your module dimensions, BOM files, or PCB schematics for an immediate engineering assessment and competitive turnaround timeline.